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22 | 02 | 2012
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  • SIPLACE breaks new grounds in electronics manufacturing

    ‘Visions become reality’ is the motto of this year’s presentation by Siemens subsidiary Siemens Electronics Assembly Systems (SEAS) at the SMT/Hybrid/Packaging in Nuremberg (May 5-7, 2009). After its successful carve-out, SEAS is particularly pro...
  • FLX2021 - Für die flexible Elektronik-Fertigung

    Der Markt für flexible Bestückungsmaschinen für die Klein- und Mittelserienfertigung in der Elektronik ist hart umkämpft. Langsame Kleinautomaten und abgespeckte High-Speed-Bestücker versuchen gleichermassen die Elektronikhersteller mi...
  • SIPLACE MultiStar CPP head: A head for all applications

    High-mix SMT production lines that adapt to changing products and perfectly balance themselves? A placement head that can process all your products, even those with the widest range of components, by switching operating modes? The new SIPLACE MultiStar ...
  • CDS6200 with two Jet dispenser systems

    To enable the proportioning of various media at a large number of proportioning points the jet-dispensing technology suggests itself. As the materials to be treated have various specific characteristics, which partial depend on the environmental condi...
  • Board underheater unit features extremely thin design

      German rework specialist company MARTIN GmbH has developed a novel programmable underheater. The Hot Plate 04 is a temperature-controlled heating plate for board assembly undersides and for the preheating of devices and RF components as well. Th...
  • Convection oven RO300FC also suitable for solder at alu.

    The convection oven RO300FC of the Suisse supplier Essemtec AG is one of the world wide mostly sold oven for small and medium sized capacities of number of pieces. The oven heats by convection solely and is applicable for the various tasks in the SMT, ...
  • Flexible production concepts & Siplace ACT

    Make your production perform better. SIPLACE placement solutions offer a broad selection of transport concepts that let you match each of your lines to your requirements and open the door to totally new production and logistics concepts. ...
  • New high flexible pick & place machine PANFLEX2

    Essemtec, the leading Swiss manufacturer of production systems for the electronics introduces with PANFLEX2 a high flexible high-speed pick & place machine into the market which is up to the demands of the various manufacturing of electronics. By us...
  • SIPLACE Recipe Analyzer & SIPLACE Precedence Finder

    This software utility automatically analyzes the size and position of components and prevents them from colliding with each other or with nozzles and grippers during the placement process. In modern PCB design, things can become rather tight – litera...
  • Essemtec launch new pick & place machine

    The new SMD pick & place machine CSM7200 from Swiss equipment maker Essemtec has been suited for the flexible manufacturing of small lot series. The machine fabricates all current components up to 40x40 mm and additionally offers an integrated disp...
  • Lotpasteninspektionssystem S3088-II QS mit bis zu 50 % erhöhter Scangeschwindigkeit

    Zum Technologie-Forum am 11./12. Februar 2009 präsentiert Viscom mit der S3088-II QS die erfolgreiche QuickScan-Lotpastenprüfung auf einer neuen Systemplattform. Die bewährte Spezialbeleuchtung wird mit einer neuen Sensorik in das System S3088-II int...
  • TÜV audits SIPLACE training: Certified Quality

    The SIPLACE training programs and trainers at the company’s training center in Vienna have been successfully certified as "Training and Consulting Centers". The auditors of TÜV Rheinland attested to the SIPLACE training center’ "premium qualit...
  • Reflow- und Curingofen mit variabler Zonenanzahl

    Der RO-VARIO von Essemtec ist ein Reflow- und Curing-Ofen, der dank seiner einzigartigen Modularität und Flexibilität für eine Vielzahl von Löt- und Aushärtungsaufgaben in der Elektronik, Solartechnik und Industrie eingesetzt werden kann. Bei der E...
  • New shutterless S-feeder improves component supply

    S-series tape feeders have been one of the most important components of many SIPLACE placement machines for many years. With its new 3x8 mm shutterless S-feeder, SIPLACE now presents another improved version in the series. Fewer movable parts mean longe...
  • Neuer Bestücker für 3D-MID

    MID-Anwendungen sind im Fokus der Automobilindustrie und der Medizintechnik. Bei "Moulded Internconnected Devices" (MID) werden die Leiterbahnen direkt auf das spritzgegossene Kunststoffteil aufgebracht oder sind integrierter Bestandteil des Bauteil...
  • Highend oder Up-to-date

    Als vor kurzer Zeit ein Hightechunternehmen aus der technologisch ehrgeizigen Elektronindustrie in den USA auf den REWORK- + DISPENSE - TECHNIC Spezialisten MARTIN, dessen Entwicklung und Manufactur sich im Fünfseenland nahe München befindet, zugekomm...
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